Systemchip til IP-kameraer med indbygget videoanalyse
Texas Instruments lancerer DMVA1, der er en systemchip til videosikkerheds kameraer med en vision co-processor til 'smart' billedanalyse (in english)
The availability of IP camera system-on-chips (SoCs) that enable full high definition (HD) resolutions now allow for the next major wave of innovation in the video surveillance market – the addition of intelligent video.
To date, the development of a video analytics system has been expensive, challenging and difficult to integrate, but those barriers are being dramatically reduced with the new industry-leading DMVA1 SoC from Texas Instruments (TI).
Specifically targeted at the video surveillance market, the DMVA1 provides entry level analytics by integrating TI’s first generation vision co-processor, which allows customers to easily deploy smart analytics functions such as people counting, trip zone, intelligent motion detection, camera tamper detection and streaming metadata.
Additionally, by coupling the vision co-processor with smart analytics all on a single chip, customers can reduce the cost of video analytics-enabled IP cameras by an order of magnitude (www.ti.com/dmva1-prhome-eu).
The DMVA1SoC is part of the next class of products in TI’s dedicated roadmap for IP camera applications, which will make video analytics a de facto feature in the market and provide more choices to security customers for their designs. In order to ease implementation and accelerate time-to-market, customers will be able to evaluate the DMVA1 video security camera SoC by ordering a complete IP camera reference design.
Relaterede nyheder
- • Ny kompakt audio hub råber højt
- • TDC åbner for HD Voice til privatkunder
- • Banebrydende 'hyperspektral' kameraløsning
- • 3,2W klasse D forstærker fylder 1mm2
- • Ny generation af klasse D audioforstærker-chips
- • HiWave viser unik højttaler- og forstærkerplatfom
- • HDMI på vej ind i nye applikationer
- • Ny aktiv støjreduktionsløsning Jabra headsets
- • Banebrydende CMOS image-sensor giver markant bedre billeder
- • CEVA udvikler referenceplatform til digital tv
- • Komplet digital audioplatform til konsumerapplikationer
- • Digital teknologi erobrer biografen
- • Nye audiochips forbedrer lydkvaliteten og forlænger batterilevetiden
- • HD-audiokvalitet i multimedia-enheder
- • Nye systemchips understøtter wireless audio
Seneste nyheder
- • Cree klar med SPICE model for banebrydende SiC-baserede MOSFETs
- • Hameg instrumenter får Rohde & Schwarz logo på fronten
- • Skyworks leverer GPS/GNSS teknologi i Samsung
- • Toshiba demonstrerer MIPI-baserede displaysløsninger
- • Ny kompakt audio hub råber højt
- • Lydløs strømforsyning til medicoapplikationer
- • Renesas satser på Eclipse
- • Løsning til fuld analyse af LTE og LTE-Advanced baserede applikationer
- • Nyt 802.11b/g modul kan erstatte gamle 802.15.4 moduler
- • Rohde & Schwarz afholder EMC-seminar
- • Nye ingeniører skal skabe fremtidens sundhedssektor
- • STRONGIT åbner Aarhus-afdeling
- • Nye chips beskytter USB forbindelser
- • TDC åbner for HD Voice til privatkunder
- • Brugerinterface til Vinco udviklingsmoduler
- • COM Express Type 6 modul med low-power Intel processorer
- • Digi-Key sælger nu LeCroy's T&M portefølje
- • EBV etablerer lyslaboratorium
- • Vicor frigiver online IBC powersimulerings-værktøj
- • Farnell i globalt samarbejde med Digilent
- • RTX lancerer ny trådløs Skype telefon
- • Det skal være lettere at udvikle 'parallel' software
- • Nye ultrakompakte clock IC'er
- • OLED-baseret mikrodisplay sætter pixel-rekord
- • TI lancerer ny generation af signalkonditionerings-kredsløb