HDMI i portable applikationer
Texas Instruments introducerer industriens første integrerede HDMI companion chip til portable applikationer (in english)
Texas Instruments (TI) has introduced the industry’s first integrated HDMI interface companion chip to the core HDMI controller for portable applications. The TPD12S015 incorporates all of the components required for an HDMI interface, including eight low-capacitance electrostatic discharge (ESD) clamps, I2C level shifters, and a DC/DC converter, saving 75 percent the board space and significantly reducing overall system cost when compared to discrete implementations.
Designers can use the TPD12S015 with TI’s OMAPTM applications processors or similar processors in a wide range of portable applications including smartphones, camcorders, digital still cameras and portable game consoles.
Key features and benefits of the TPD12S015:
- Internal boost converter generates 5 V from a 2.3-V to 5.5-V battery voltage, which eliminates the need for an on-board 5-V supply to drive the HDMI 5-V output pin.
- Matched HDMI Class-C connector pin-mapping eliminates board design layout skew that typically occurs with discrete implementations.
- Auto-direction sensing level shifter with integrated pull-ups and edge-rate control circuits eliminate the need for an additional on board I2C cable driver circuit.
- The DDC and CEC control lines can drive longer HDMI cable, amount to at least 750pF load, exceeding the HDMI standard defined 700pF maximum load.
The TPD12S015 is in volume production today with samples ready to ship. This device comes in an industry-leading, small-footprint WCSP package (1.6 mm x 2.8 mm) with 0.4-mm pitch.
TPD12S015 datasheet: www.ti.com/tpd12s015-preu.
TPD12S015 samples: www.ti.com/tpd12s015-preu.
Relaterede nyheder
- • Ny kompakt audio hub råber højt
- • TDC åbner for HD Voice til privatkunder
- • Banebrydende 'hyperspektral' kameraløsning
- • 3,2W klasse D forstærker fylder 1mm2
- • Ny generation af klasse D audioforstærker-chips
- • HiWave viser unik højttaler- og forstærkerplatfom
- • HDMI på vej ind i nye applikationer
- • Ny aktiv støjreduktionsløsning Jabra headsets
- • Banebrydende CMOS image-sensor giver markant bedre billeder
- • CEVA udvikler referenceplatform til digital tv
- • Komplet digital audioplatform til konsumerapplikationer
- • Digital teknologi erobrer biografen
- • Nye audiochips forbedrer lydkvaliteten og forlænger batterilevetiden
- • HD-audiokvalitet i multimedia-enheder
- • Nye systemchips understøtter wireless audio
Seneste nyheder
- • Cree klar med SPICE model for banebrydende SiC-baserede MOSFETs
- • Hameg instrumenter får Rohde & Schwarz logo på fronten
- • Skyworks leverer GPS/GNSS teknologi i Samsung
- • Toshiba demonstrerer MIPI-baserede displaysløsninger
- • Ny kompakt audio hub råber højt
- • Lydløs strømforsyning til medicoapplikationer
- • Renesas satser på Eclipse
- • Løsning til fuld analyse af LTE og LTE-Advanced baserede applikationer
- • Nyt 802.11b/g modul kan erstatte gamle 802.15.4 moduler
- • Rohde & Schwarz afholder EMC-seminar
- • Nye ingeniører skal skabe fremtidens sundhedssektor
- • STRONGIT åbner Aarhus-afdeling
- • Nye chips beskytter USB forbindelser
- • TDC åbner for HD Voice til privatkunder
- • Brugerinterface til Vinco udviklingsmoduler
- • COM Express Type 6 modul med low-power Intel processorer
- • Digi-Key sælger nu LeCroy's T&M portefølje
- • EBV etablerer lyslaboratorium
- • Vicor frigiver online IBC powersimulerings-værktøj
- • Farnell i globalt samarbejde med Digilent
- • RTX lancerer ny trådløs Skype telefon
- • Det skal være lettere at udvikle 'parallel' software
- • Nye ultrakompakte clock IC'er
- • OLED-baseret mikrodisplay sætter pixel-rekord
- • TI lancerer ny generation af signalkonditionerings-kredsløb