'Superspeed' USB 3.0 til harddisk drev
NEC Electronics og storage-producenten WD samarbejde om ny 'Superspeed' USB 3.0 standard (in english).
WD, a world leader in external storage solutions, and NEC Electronics Corporation, a leading provider of semiconductor solutions, today announces that the companies have collaborated to promote the new SuperSpeed Universal Serial Bus (USB) 3.0 standard, a next-generation interface to be used in a wide range of electronic devices including PCs, PC peripherals, and digital appliances.
USB 3.0 is capable of supporting data transfer rates of up to 5 gigabits per second (Gbps), which is 10 times faster than the previous high-speed USB 2.0 transfer speeds. With its higher speeds and enhanced power efficiency, external hard disk drives are the first SuperSpeed USB 3.0 devices to appear on the market.
As the first step toward WD’s and NEC Electronics’ goal to promote the SuperSpeed USB 3.0 standard, the companies plan to develop a USB Attached SCSI Protocol (UASP) driver to deliver hard drives with very high performance, mass-storage capacity.
UASP is a new industry-standard, high-performance mass-storage protocol being developed for SuperSpeed USB 3.0 to overcome the performance boundaries of the Bulk Only Transfer (BOT) protocol, which has been used for traditional USB 2.0 speeds. The new UASP driver will be used with NEC Electronics’ USB 3.0 xHCI (eXtensible Host Controller Interface) host controller (part number µPD720200), which appeared on the market as the world’s first USB 3.0 host controller in June 2009.
Among th key features of the new UASP driver is:
- Support for the UASP mass-storage protocol.
- Data transfer rate is enhanced by 30 percent, with optimized power efficiency and smooth interoperability, compared to the existing BOT protocol.
- NEC Electronics’ license program is available for any LSI (large scale integration) vendors who develop UASP-based LSI devices.
- The wide adoption of external storage, for both expanding and backing up internal computer storage, highlights the need for faster interface transfer rates. The USB 3.0 interface offers a significant advance in data transfer speed, says Robert Caddy, Jr., vice president of engineering for WD’s Branded Products Group.
- Partnering with WD enables us to combine our USB transfer technology with WD’s data storage technology and provide added value to our customers, says Masao Hirasawa, deputy general manager, Home Multimedia Division, NEC Electronics Corporation.
- Starting with the new HDDs, WD and NEC Electronics are working together as the industrial leaders to expand USB 3.0 marketplace offerings with the highest quality and performance solutions while speeding time to market.
Relaterede nyheder
- • Acal BFi vil forsyne markedet med hurtige synkrone SRAM'er
- • Nyt microSD kort sigter mod industriapplikationer
- • Toshiba klar med USB 3.0 kompatibel USB flash hukommelse
- • Første 256 GB CompactFlash kort
- • SLC NAND flash med indbygget fejlkorrektion
- • Industrigiganter samarbejder om den næste generation af memoryteknologier
- • Første single-chip 128 gigabit NAND flash-hukommelse
- • Ny embedded SRAM-teknik baner vej for markant reduktion af effektforbruget
- • Samsung og Micron vil nedbryde memory-muren
- • Solid state disks er optimeret til militære og aerospace applikationer
- • Dramatisk fald i DRAM-priserne
- • 32 GB DDR3 hukommelser anvender '3D' teknologi
- • 512 GB solid state disk med SATA 3.0 interface
- • Dedikeret produktionsfacilitet til tyndfilms hukommelser er åbnet
- • Nye solid state disk til industriapplikationer
Seneste nyheder
- • Cree klar med SPICE model for banebrydende SiC-baserede MOSFETs
- • Hameg instrumenter får Rohde & Schwarz logo på fronten
- • Skyworks leverer GPS/GNSS teknologi i Samsung
- • Toshiba demonstrerer MIPI-baserede displaysløsninger
- • Ny kompakt audio hub råber højt
- • Lydløs strømforsyning til medicoapplikationer
- • Renesas satser på Eclipse
- • Løsning til fuld analyse af LTE og LTE-Advanced baserede applikationer
- • Nyt 802.11b/g modul kan erstatte gamle 802.15.4 moduler
- • Rohde & Schwarz afholder EMC-seminar
- • Nye ingeniører skal skabe fremtidens sundhedssektor
- • STRONGIT åbner Aarhus-afdeling
- • Nye chips beskytter USB forbindelser
- • TDC åbner for HD Voice til privatkunder
- • Brugerinterface til Vinco udviklingsmoduler
- • COM Express Type 6 modul med low-power Intel processorer
- • Digi-Key sælger nu LeCroy's T&M portefølje
- • EBV etablerer lyslaboratorium
- • Vicor frigiver online IBC powersimulerings-værktøj
- • Farnell i globalt samarbejde med Digilent
- • RTX lancerer ny trådløs Skype telefon
- • Det skal være lettere at udvikle 'parallel' software
- • Nye ultrakompakte clock IC'er
- • OLED-baseret mikrodisplay sætter pixel-rekord
- • TI lancerer ny generation af signalkonditionerings-kredsløb