ERNI udvider aktiviteter
ERNI Electronics udvider nu paletten af udvikklings- og produktionsservices (in english).
ERNI Electronics is consistently extending its range of services in the systems engineering business area, in which the company already earns about 30 percent of its total revenue.
The company is concentrating on the development and manufacturing of backplanes, electronic assemblies and sub-systems, and is focussing on cost-effective SMT technology. ERNI's range of services includes all design and manufacturing stages such as planning, connector design, PCB layouts, circuit diagrams, simulation, prototyping, mechanical design, power supplies and cooling through to the fully equipped and tested end product.
ERNI’s core competence lies in its powerful range of connectors, which have been optimised to suit modern cost-effective manufacturing methods. This expertise has been expanded by integrating a company, which specialises in soldering technology, SMT manufacturing and assembly.
A wide range of active board products and sub-systems can be supplied from a single source due to the company’s extensive know-how in SMT, THR and THT soldering. This significantly expands the company’s customer basis. In addition, as a pioneer in pressfit technology, ERNI has driven the development of this solderless connecting technology, offering cost-effective solutions for a large number of applications.
The company’s SMT assembly capacity has been increased, making it possible to process more than 30,000 components per hour with assembly sizes of up to 510mm x 407mm. Fine-pitch components with a pitch of just 0.3mm can also be processed without any problems.
ERNI has complete process lines from stencil printing to rapid pick & place robots and soldering systems for reflow soldering with or without lead through to automatic optical inspection (AOI) and fast digital and analogue testers. Active board products can be efficiently manufactured in small and large volume. Functionality and top quality are ensured by using in-circuit and functional testing.
Modern soldering systems (full-tunnel wave soldering systems with nitrogen atmosphere) for the processing of wired components (THT) are available, whereby soldering can be carried out with or without lead. Relevant equipment for handling extremely moisture-sensitive components is also available, such as an active drying cupboard with vacuum equipment and suitable storage conditions.
ERNI is making use of its core competence and many years of experience to make further investments in the systems engineering sector. Amongst other, a fully automatic selective soldering system is planned. From the middle of the year onwards the scope of the company’s services will also include the repair of SMT fine-pitch components.
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