Send til en ven   Udskriv7/5 2009 kl. 13:42
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Ny ultratynd chippakning

Texas Instruments introducerer nu den ultratynde PicoStar pakning, der sigter mod konsumerprodukter. Første produkt er en ESD-løsning (in english).

Portable consumer electronics designers can save board space with integrated circuits (ICs) in the PicoStar package that Texas Instruments (TI) is introducing now. The ultra-thin package, about as thin as a human hair, is the first to give system designers the option to embed silicon components inside the printed circuit board (PCB) to maximize board space. 

Devices in this form factor are 50 percent thinner than similar chips in traditional packages and enable smaller, thinner end equipment. The TPD2E007, a two-channel, robust electrostatic discharge (ESD) solution, is the first device available in the ultra-thin PicoStar package. www.ti.com/tpd2e007-pr.
 
The TPD2E007 is a back-to-back diode array that allows AC-coupled data transmission without compromising signal integrity. Typically, ESD protection is mounted close to the connector on the PCB, but designers have the option to surface mount or embed the TPD2

E007 into the board/connector. The ability to embed this ultra-thin device in the board allows designers to save 80 percent board space compared to typical ESD solutions.
 
Additional TI devices will be developed in PicoStar packaging, such as the TPS62620 low-power DC/DC converter, which is sampling now and will be available in volume production in 3Q09.

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