Send til en ven   Udskriv11/3 2009 kl. 14:44
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Ny OMAP 4 platform præsenteret

Texas Instruments løfter nu sløret for den nye multicore OMAP 4 platform, der baner vejen for nye højtydende computer- og kommunikationssystemer (in english).

Texas Instruments Inc. (TI) has announced the new OMAP 4 mobile applications platform. The OMAP 4 platform delivers new multimedia-rich user experiences such as 1080p video record and playback, 20 megapixel (MP) imaging and approximately a week of audio play time.

The new platform provides significant improvements in performance and play time compared to today’s most popular Smartphones, with 10x faster Web page loading times, more than 7x higher computing performance, 6x higher video
resolution, 10x better graphics performance and 6x longer audio play time.


At the heart of the OMAP 4 platform is a powerful system-on-chip that includes the perfect balance of power efficiency and high performance. The OMAP 4 processor balances processing across four main engines: a programmable multimedia engine based on TI’s C64x DSP and power-efficient, multi-format hardware accelerators; general-purpose processing based on the dual-core ARM Cortex-A9 MPCore supporting symmetric multiprocessing (SMP) and capable of speeds of more than 1GHz per core; a high-performance programmable graphics engine; and an Image Signal Processor (ISP) for unparalleled video and imaging performance.

The OMAP 4 platform also includes a comprehensive software suite, power management technology and other supporting components, providing the foundation necessary to create devices with mobile computing performance at low power.

- For the past decade, TI has focused on providing an optimal balance of high performance and low power consumption in our OMAP product line to address our customers’ needs to quickly and easily address new market trends, says Greg Delagi, senior vice president and head of TI's Wireless Business Unit.
- The OMAP 4 platform will enable a new class of mobile devices that will redefine the boundaries of Smartphones and
MIDs.

The OMAP 4 platform, built in 45-nanometer (nm) process technology, enables mobile device manufacturers to address the expected applications of tomorrow’s handsets, while also providing headroom and programmability to support applications that have yet to be imagined.

The new platform will support popular leading mobile operating systems and is validated for real-world use cases, taking into account the many elements of the mobile consumer’s experience to simplify application creation and help handset manufacturers get to market quickly.

TI's OMAP 4 platform and development tools are expected to sample in the second half of 2009, with production expected by the second half of 2010. OMAP products are intended for high-volume wireless OEMs and ODMs and are not available through distributors.

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