Send til en ven   Udskriv10/6 2010 kl. 10:26
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CEVA DSP-kerne i Infineons mobile platforme

CEVA indgår partnerskab med Infineon Technologies omkring udvikling af næste generation af trådløse platforme (in english).

CEVA, Inc., a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Infineon Technologies today announced the companies have extended their long-term strategic relationship to include the dual MAC, 32-bit CEVA-TeakLite-III DSP core for the future mobile phone and modem platform solutions from Infineon.

This latest agreement enables Infineon to leverage the superior features and processing performance offered by the latest generation CEVA-TeakLite-III DSP architecture while maintaining code compatibility with the existing CEVA-based Infineon architectures. The CEVA-TeakLite-III delivers industry-leading DSP performance required for advanced modem, voice and audio processing while maintaining low power and small die size.


- DSP plays an essential role in overall power consumption and performance in handsets and the CEVA-TeakLite-III DSP brings to Infineon the capability to dramatically improve future wireless and multimedia processor designs, says Gideon Wertheizer, CEO of CEVA.
- We look forward to continuing our long standing partnership with Infineon to advance their leadership in mobile phone and modem platforms.

CEVA's industry-leading DSP cores power many of the world's leading handsets today, with all top five handset OEMs shipping CEVA-powered phones. To date, more than 700 million CEVA-powered handsets have shipped worldwide spanning the entire value chain, from ultra-low cost devices through to smartphones.

Addressing next-generation 4G terminal and infrastructure markets, CEVA’s latest generation DSPs have been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance multimode 2G/3G/4G solutions.

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