Send til en ven   Udskriv11/5 2010 kl. 9:59
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AMD lancerer nye embedded platforme

AMD lancerer nye low-power CPU'er, chipsæts og grafikløsninger til embedded applikationer (in english).

AMD has announced two new complete platforms for the embedded market, the compact ASB2 platform (BGA) and the high-performance AM3 platform, that offer myriad combinations of power and performance with up to 74 percent improvement in performance-per-watt over previous generations.

AMD's new flexible embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP for the ideal solution based on application requirements. System designers focusing on their next-generation products can see immediate benefits commonly associated with industry-standard x86 processors, including streamlined design and development, a large software ecosystem, and fast time-to-market.


- The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon, says Buddy Broeker, director, Embedded Solutions Division, AMD.

- AMD's embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion™ technology products into the embedded space.

New platform features

- Faster memory with support for 2 channels DDR3
- Improved I/O for high-throughput and real-time applications with available 
- HyperTransport 3.0 technology
- ECC for high-reliability applications like SMB/SOHO storage systems
- Multiple CPU options that offer wide choice of performance and power: Power envelopes in 8, 12, 15, 25, 45, and 65 watts TDP with Single-, dual- and quad-core up to 2.8 GHz
- AMD 785E chipset with support for PCI Express 2.0
- New ATI Radeon HD 4200 graphics with DirectX 10.1, full 1080p display resolution support, HDMI, and power-savings capability with options to support multiple displays
- Socket AM3 package, compatible with socket AM2 when using DDR2 memory for increased design flexibility and scalability
- Lidless BGA package offers low-cost to manufacture, high reliability, and low z-height for small form factors and fan-less designs

The processor variants, each of which is combined with the AMD785E / SB850M chipsets and which support the Direct Connect Architecture for a simplified board design, are available on the ASB2 platform of the AMD Turion II Neo single-core processor at 1.0 GHz up to the AMD Turion II Neo dual-core processor at 2.2 GHz.

The AM3 platform is scalable from the Athlon II XLT Dual Core processor with 2.0 GHz up to the AMD Phenom II XLT Quad-Core Processor (2.2 GHz). In total, 9 performance classes were launched alongside the AMD785E, all of which support 64-bit.

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